reference spec.no.jenf243a-9103h-01 p1/8 murata mfg.co.,ltd. reference only chip ferrite bead blm15 sh1d reference specification [aec-q200] 1.scope this reference specification applies to chip ferri te bead blm15_sh series for automotive electronics based on aec-q200. 2.part numbering (ex.) bl m 15 ag 102 s h 1 d (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)product id (4)characteristics (7)category(for automotive electronics) (2)type (5)typical impedance at 100mhz (8)numbers of circuit (3)dimension (l ) (6)performance (9)packaging (d:taping) 3.rating customer part number murata part number impedance ( ? ) (at 100mhz) (*1) (refer to below comment) rated current (ma) dc resistance ( ? max.) (*1) (refer to below comment) esd rank 2 :2kv initial values values after testing blm15ag100sh1d 5 15 1000 0.05 0.10 2 BLM15AG700SH1D 40 100 500 0.15 0.20 blm15ag121sh1d 120 25% 500 0.25 0.35 blm15ag221sh1d 220 25% 300 0.35 0.45 blm15ag601sh1d 600 25% 300 0.60 0.70 blm15ag102sh1d 1000 25% 200 1.0 1.1 blm15bb050sh1d 5 25% 500 0.08 0.15 blm15bb100sh1d 10 25% 300 0.10 0.15 blm15bb220sh1d 22 25% 300 0.20 0.30 blm15bb470sh1d 47 25% 300 0.35 0.45 blm15bb750sh1d 75 25% 300 0.40 0.50 blm15bb121sh1d 120 25% 300 0.55 0.65 blm15bb221sh1d 220 25% 200 0.80 0.90 blm15bd471sh1d 470 25% 200 0.60 0.70 blm15bd601sh1d 600 25% 200 0.65 0.75 blm15bd102sh1d 1000 25% 200 0.90 1.0 blm15bd182sh1d 1800 25% 200 1.4 1.5 operating temperature : -55c to +125c storage temperature : -55c to +125c (*1) standard testing conditions ? unless otherwise specified ? ? in case of doubt ? temperature : ordinary temp. (15 c to 35 c ) temperature : 20 c 2 c humidity : ordinary humidity (25%(rh) to 85% (rh)) humidity : 60%(rh) to 70%(rh) atmospheric pressure : 86kpa to 106kpa 4.style and dimensions equivalent circuit unit weight (typical value) 0.001g resistance element becomes dominant at high frequencies. () :electrode 1.00.05 0.50.05 0.250.1 0.50.05 (in mm)
reference spec.no.jenf243a-9103h-01 p2/8 murata mfg.co.,ltd. reference only 5.marking no marking. 6.specifications 6-1.electrical performance no. item specification test method 6-1-1 impedance meet item 3. measuring frequency : 100mhz1mhz measuring equipment : keysight4291a or the equivalent test fixture : keysight16192a or the equivalent 6-1-2 dc resistance meet item 3. measuring equipm ent : digital multi meter *except resistance of the substrate and wire 6-2.mechanical performance (based on table 13 for filter emi suppressors/filters) aec-q200 rev.d issued june. 1 2010 aec-q200 murata specification / deviation no. stress test method 3 high temperature exposure 1000hours at 125 deg c set for 24hours at room temperature, then measured. meet table a after testing. table a 4 temperature cycling 1000cycles -55 deg c to +125 deg c set for 24hours at room temperature, then measured. meet table a after testing. 5 destructive physical analysis per eia469 no electrical tests no defects 7 biased humidity 1000hours at 85 deg c, 85%rh apply max rated current. meet table a after testing. appearance no damage impedance change (at 100mhz) within 30% dc resistance meet item 3.
reference spec.no.jenf243a-9103h-01 p3/8 murata mfg.co.,ltd. reference only aec-q200 murata specification / deviation no. stress test method 8 operational life apply 125 deg c 1000hours set for 24hours at room temperature, then measured meet table a after testing. if the rated current of parts exceed 1a, the operating temperatur e should be 85 deg c. 9 external visual visual inspection no abnormalities 10 physical dimension meet item 4 style and dimensions no defects 12 resistance to solvents per mil-std-202 method 215 not applicable 13 mechanical shock per mil-std-202 method 213 condition f: 1500g's(14.7n)/0.5ms/half sine meet table a after testing. 14 vibration 5g's(0.049n) for 20 minutes 12cycles each of 3 oritentations test from 10-2000hz. meet table a after testing. 15 resistance to soldering heat solder temperature 260c+/-5 deg c immersion time 10s pre-heating: 150c +/-10 deg c, 60s to 90s meet table a after testing. 17 esd per aec-q200-002 esd rank: meet item 3 (rating) blm15ag sereis: meet table a after testing. blm15bb/bd series: meet table b after testing. table b 18 solderability per j-std-002 method b : not applicable 95% of the terminations is to be soldered. 19 electrical characterization measured : impedance no defects 20 flammability per ul-94 not applicable 21 board flex epoxy-pcb(1.6mm) deflection 2mm(min) 60s minimum holding time meet table a after testing. 22 terminal strength per aec-q200-006 murata deviation request: 5n no defects 30 electrical transient conduction per iso-7637-2 not applicable appearance no damage impedance change (at 100mhz) within 40% dc resistance meet item 3.
reference spec.no.jenf243a-9103h-01 p4/8 murata mfg.co.,ltd. reference only 7.specification of packaging 7-1.appearance and dimensions (8mm-wide paper tape) (1) taping products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pit ch continuously and sealed by top tape and bottom tape. (2) sprocket hole:sprocket hole shall be located on the left hand side toward t he direction of feed. (3) spliced point:the base tape and top tape have no spliced point (4) cavity:there shall not be burr in the cavity. (5) missing components number missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. the specified quant ity per reel is kept.. 7-2.tape strength (1)pull strength top tape 5n min. bottom tape (2)peeling off force of cover tape 0.1n to 0.6n (minimum value is typical.) *speed of peeling off:300mm/min 7-3.taping condition (1)standard quantity per reel quantity per 180mm reel 10000 pcs. / reel (2)there shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows. (3)on paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)marking for reel the following items shall be marked on a l abel and the label is stuck on the reel. (customer part number, murata part number, inspection number( ? 1) , rohs marking( ? 2) , quantity, etc) ? 1) ? expression of inspection no. ? oooo ??? (1) (2) (3) (1) factory code (2) date first digit : year / last digit of year second digit : month / jan. to sep. ? 1 to 9, oct. to dec. ? o,n,d third, fourth digit : day (3) serial no. ? 2) ? expression of rohs marking ? rohs ? y ( ) (1) (2) (1) rohs regulation conformity parts. (2) murata classification number (5)outside package these reels shall be packed in the corrugated car dboard package and the following items shall be marked on a label and the label is stuck on the box. (customer name, purchasing order number, cu stomer part number, murata part number, rohs marking( ? 2) ,quantity, etc) f 165 to 180 degree top tape bottom tape base tape 0.8max. 0.65(typ.) 1.15(typ.) (in mm) 2.00.05 2.00.05 4.00.1 ? 1.5 +0.1 -0 1.750.1 3.50.05 8.00.3 direction of feed
reference spec.no.jenf243a-9103h-01 p5/8 murata mfg.co.,ltd. reference only (6)dimensions of reel and t aping(leader-tape, trailer-tape) (in mm) 7-4. specification of outer case outer case dimensions (mm) standard reel quantity in outer case (reel) w d h 186 186 93 5 ?? above outer case size is typical. it is depend on a quantity of an order. 8. caution 8-1.rating do not use products beyond the operati ng temperature range and rated current. 8-2.surge current excessive surge current (pulse current or rush current) than specified rat ed current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. please contact us in advance in ca se of applying the surge current. 8-3.fail safe be sure to provide an appropriate fail-safe functi on on your product to prevent from a second damage that may be caused by the abnormal func tion or the failure of our products. 8-4.limitation of applications please contact us before using our pr oducts for the applications listed bel ow which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)aircraft equipment (6 )disaster prevention / cr ime prevention equipment (2)aerospace equipment (7)traffic signal equipment (3)undersea equipment (8)t ransportation equipment (t rains, ships, etc.) (4)power plant control equipment (9) data-processing equipment (5)medical equipment (10)a pplications of similar complexity and /or reliability requirements to the applications listed in the above empty tape 190 min. leader trailer 2.00.5 ? 13.00.2 ? 21.00.8 ? 180 ? 60 9.0 13.01.4 +1 - 0 +0 -3 direction of feed 210 min. 160 min. top tape +1 -0 label w d label h
reference spec.no.jenf243a-9103h-01 p6/8 murata mfg.co.,ltd. reference only 9. notice this product is designed for solder mounting. please consult us in advance for applying other mounting method such as conductive adhesive. 9-1.land pattern designing ??? standard land dimensions (reflow soldering) (in mm) 9-2.soldering conditions products can be applied to reflow soldering. (1) flux,solder flux use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) do not use water-soluble flux. solde r use sn-3.0ag-0.5cu solde r standard thickness of solder paste : 100 m to 200 ? m (2) soldering conditions ?? pre-heating should be in such a way that the temperature difference between so lder and ferrite surface is limited to 150 max. also cooling into solvent after soldering s hould be in such a way that the temperature difference is limited to 100 max. insufficient pre-heating may cause cracks on the ferrite , resulting in the deterio ration of product quality. ?? standard soldering profile and the limit soldering profile is as follows. the excessive limit soldering conditions may c ause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile standard profile limit profile pre-heating 150 180c 90s 30s heating above 220c 30s 60s above 230c 60s max. peak temperature 245 3c 260c,10s cycle of reflow 2 times 2 times 9-3. soldering iron ?? pre-heating: 150c, 1 min ?? soldering iron output: 80w max. ?? tip temperature: 350c max. ? tip diameter: 3mm max. ?? soldering time : 3(+1,-0) seconds. ? times : 2times max. note :do not directly touch the produc ts with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 0.4 1.2 to 1.4 chip ferrite bead solder resist pattern 0.5 limit profile standard profile 90s30s 230 260 2453 220 30s 60 s 60s max. 180 150 temp. ( s) ( ) time.
reference spec.no.jenf243a-9103h-01 p7/8 murata mfg.co.,ltd. reference only 9-4.solder volume solder shall be used not to be exceeded as shown below. 1/3t Q t Q t (t:chip thickness) accordingly increasing the solder volume, the me chanical stress to product is also increased. exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5.attention regarding p.c.b. bending the following shall be considered w hen designing and laying out p.c.b.'s. (1) p.c.b. shall be designed so that products are not subject to the mechanical stress for board warpage. products shall be located in the sideways direction (length:a ? b) to the mechanical stress. (2) components location on p.c.b. separation. it is effective to implement the following meas ures, to reduce stress in separating the board. it is best to implement all of the following three m easures; however, implement as many measures as possible to reduce stress. contents of measures stress level (1) turn the mounting direction of the component parallel to the board separation surface. a > d *1 (2) add slits in the board separation part. a > b (3) keep the mounting position of the component away from t he board separation surface. a > c *1 a > d is valid when stress is added vertically to the perforation as with hand separation. if a cutting disc is used, stress will be diagonal to the pcb, therefore a > d is invalid. (3) mounting components near screw holes when a component is mounted near a scr ew hole, it may be affected by the board deflecti on that occurs during the tightening of the screw. mount the component in a position as far away from the screw holes as possible. 9-6.mounting density add special attention to radiating heat of products when mount ing the inductor near the products with heating. the excessive heat by other products may cause deterioration at joint of this product with substrate. recommendable upper limit t poor example good example b a perforation slit a b c d screw hole recommended
reference spec.no.jenf243a-9103h-01 p8/8 murata mfg.co.,ltd. reference only 9-7. operating environment do not use this product under the following environment al conditions, on deterioration of the insulation resistance of the ferrite material and/or corrosi on of inner electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, cl2, h2 s, nh3, so2, no2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where t he temperature / humidity changes rapidly and it is easy to dew. 9-8. resin coating the impedance value may change and/or it may affect on t he product's performance due to high cure-stress of resin to be used for coating / molding products. so please pay your careful attention when you select resin. in prior to use, please make the reliability evaluat ion with the product mounted in your application set. 9-9.cleaning conditions products shall be cleaned on the following conditions. (1)cleaning temperature s hall be limited to 60c max. (40c max. for ipa.) (2)ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and p.c.b. power:20w/ ? max. frequency:28khz to 40khz time:5 min max. (3)cleaner 1.alternative cleaner ? isopropyl alcohol (ipa) 2.aqueous agent ? pine alpha st-100s (4)there shall be no residual flux and residual cleaner after cleaning. in the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)other cleaning please contact us. 9-10. handling of a substrate after mounting products on a substrat e, do not apply any stress to the pr oduct caused by bending or twisting to the substrate when cropping the substr ate, inserting and removing a connecto r from the substrate or tightening screw to the substrate. excessive mechanical stress may cause cracking in the product. bending twisting 9-11.storage conditions (1)storage period use the products within 6 months after delivered. solderability should be checked if this period is exceeded. (2)storage conditions ?? products should be stored in the wa rehouse on the following conditions. temperature : -10c to 40c humidity : 15% to 85% relative humidity no rapid change on tem perature and humidity ?? don't keep products in corrosive gases such as sulfur , chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ? products should be stored on the pale tte for the prevention of the infl uence from humidity, dust and so on. ?? products should be stored in the war ehouse without heat shock, vi bration, direct sunlight and so on. ?? products should be stored under the airtight packaged condition. (3)delivery care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10 . ! note (1)please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)you are requested not to use our product deviating from the agr eed specifications. (3)the contents of this reference specification are subject to change without advance notic e. please approve our product specifications or tr ansact the approval sheet for produc t specifications before ordering.
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